JPH0195014U - - Google Patents
Info
- Publication number
- JPH0195014U JPH0195014U JP19088487U JP19088487U JPH0195014U JP H0195014 U JPH0195014 U JP H0195014U JP 19088487 U JP19088487 U JP 19088487U JP 19088487 U JP19088487 U JP 19088487U JP H0195014 U JPH0195014 U JP H0195014U
- Authority
- JP
- Japan
- Prior art keywords
- electrically insulating
- conductive adhesive
- flat cable
- tape
- ground wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000012777 electrically insulating material Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Communication Cables (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19088487U JPH0195014U (en]) | 1987-12-16 | 1987-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19088487U JPH0195014U (en]) | 1987-12-16 | 1987-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195014U true JPH0195014U (en]) | 1989-06-22 |
Family
ID=31481823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19088487U Pending JPH0195014U (en]) | 1987-12-16 | 1987-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195014U (en]) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04211189A (ja) * | 1990-03-22 | 1992-08-03 | Canon Inc | 回路基板の製造方法 |
| JP2002118339A (ja) * | 2000-10-05 | 2002-04-19 | Sony Chem Corp | 配線基板及び配線基板製造方法 |
| JP2002184245A (ja) * | 2000-12-13 | 2002-06-28 | Hitachi Cable Ltd | シールド付きフラットケーブル |
| JP2002279831A (ja) * | 2001-03-19 | 2002-09-27 | Dainippon Printing Co Ltd | フラットケーブル用シールド材及びシールド付きフラットケーブル |
| JP2003110279A (ja) * | 2001-09-28 | 2003-04-11 | Dainippon Printing Co Ltd | 電磁波シールド材および電磁波シールド付きフラットケーブル |
| WO2009090927A1 (ja) * | 2008-01-17 | 2009-07-23 | Sony Chemical & Information Device Corporation | フラットケーブル |
-
1987
- 1987-12-16 JP JP19088487U patent/JPH0195014U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04211189A (ja) * | 1990-03-22 | 1992-08-03 | Canon Inc | 回路基板の製造方法 |
| JP2002118339A (ja) * | 2000-10-05 | 2002-04-19 | Sony Chem Corp | 配線基板及び配線基板製造方法 |
| JP2002184245A (ja) * | 2000-12-13 | 2002-06-28 | Hitachi Cable Ltd | シールド付きフラットケーブル |
| JP2002279831A (ja) * | 2001-03-19 | 2002-09-27 | Dainippon Printing Co Ltd | フラットケーブル用シールド材及びシールド付きフラットケーブル |
| JP2003110279A (ja) * | 2001-09-28 | 2003-04-11 | Dainippon Printing Co Ltd | 電磁波シールド材および電磁波シールド付きフラットケーブル |
| WO2009090927A1 (ja) * | 2008-01-17 | 2009-07-23 | Sony Chemical & Information Device Corporation | フラットケーブル |
| JP2009170291A (ja) * | 2008-01-17 | 2009-07-30 | Sony Chemical & Information Device Corp | フラットケーブル |